MICROTHERM 2017

MicroTherm is an International Conference on Microtechnology and Thermal Problems in Electronics being organised as a cyclic event. The success of the first seminar in 1996, that was devoted mainly to thermal management aspects, and the successive conferences have led us to the twelfth edition. Since the first meeting, the scope of the Conference has expanded, following the electronics progress. Now, it covers the subjects connected with extreme temperature electronics, sensors and measurement techniques, modelling, simulation, wide band-gap materials, packaging and reliability, renewable energy sources and photonics with special emphasis on microelectronic technologies.

 

The main topics of the Conference are:

A optimizing designs of semiconductor devices, integrated and hybrid circuits, and electronic equipment,
B reliability and thermal management of electronic elements, devices and systems,
C investigation and measurements of semiconductor devices, materials and electronic systems,
D extreme temperature electronics (materials, devices and circuits),
E processes of microelectronics technology and packaging of electronics elements,
F wide-band gap materials,
G renewable energy solutions (especially dedicated for photovoltaic and power harvesting),
H photonic and optoelectronic devices and systems,
I integrated microsystems
J electronics for biomedical engineering

 

The programme of the Conference is conformed to its basic task, i.e. to create the opportunity to present the achievements in the field of thermal management and microtechnology. Apart from the general sessions covering the main Conference topics, each MicroTherm includes a special one – Students' Session - dedicated to students and young researchers.

Traditionally, the papers presented at MicroTherm are published in two forms. The Conference Proceedings cover a book of extended abstracts. Next, the extended manuscripts, are submitted to different journals and subjected to the review process.

 

Scientific Committee

 

Conference Chairman

  Zbigniew LISIK, Lodz UT, Poland

Conference Co-Chairman

  Jan SZMIDT, Warsaw UT, Poland

 

Mietek BAKOWSKI, ACREO AB, Sweden
Romuald BECK, Warsaw UT, Poland
Vitezslav BENDA, TU Prague, Czech Republic
Christian BOIT, TU Berlin, Germany
Gilbert DE MEY , Ghent University, Belgium
Paolo DI BARBA , University of Pavia, Italy
Piotr DUMANIA, ITE Warsaw, Poland
Bertrand FILLON, CEA-LITEN, France
Frederic GAFFIOT, DERITT, France
Andrzej JAKUBOWSKI, Warsaw UT, Poland
Wlodzimierz JANKE, TU Koszalin, Poland
Colin JOHNSTON, HITEN, Oxford University, UK
Ryszard KISIEL, Warsaw UT, Poland - IEEE
Zbigniew KLUSEK, UL, Poland
Stanislas KRAWCZYK, France
Michal LESZCZYŃSKI, TOPGAN, Poland
Mykhaylo LOBUR, Lviv Politechnic National University, Ukraine
Wlodzimierz NAKWASKI, Lodz UT, Poland
Andrzej NAPIERALSKI, Lodz UT, Poland
Regina PASZKIEWICZ, Wroclaw UT, Poland
Ryszard PAWLAK, Lodz UT, Poland
Jozef PIOTROWSKI, Vigo, Poland
Tadeusz PISARKIEWICZ, AGH University of Science and Technology, Poland
Dominique PLANSON, INSA, France
Ivo RANGELOW, Ilmenau UT, Germany
Nicolo RINALDI, University of Naples, Italy
Noel SHAMMAS, Staffordshire University, UK
Thomas SKOTNICKI, ST Microelectronics, France
Andrzej STROJWAS, Carnegie Mellon, USA
Pawel SZCZEPAŃSKI, Warsaw UT, Poland
Roman SZELOCH, TU Wroclaw, Poland
Marek TŁACZAŁA, TU Wroclaw, Poland
Marek TUROWSKI, Silvaco Inc. USA
Andreas WAAG, TU Braunschweig, Germany
Gerhard WACHUTKA, Munich UT, Germany
Boguslaw WIĘCEK, Lodz UT, Poland
Janusz ZARĘBSKI, Gdynia Maritime University, Poland
Jerzy ZDANOWSKI, TU Wroclaw, Poland

 

Organising Committee

 

Jacek PODGÓRSKI, Lodz University of Technology, Poland
Ewa RAJ, Lodz University of Technology, Poland
Mariusz SOCHACKI, Warsaw University of Technology, Poland
Natalia SZCZECIŃSKA, Lodz University of Technology, Poland
Katarzyna ZNAJDEK, Lodz University of Technology, Poland